ROBATECH GLUING SOLUTIONS

Robatech’s new hot-melt application head delivers the smallest dot and bead application for demanding gluing applications in the packaging, converting, and graphic industry. Smallest installation dimensions, speed, and durability characterize this jetting head. SpeedStar Compact can be easily integrated into systems with limited space. Thanks to the electronic unit being detached from the jetting head,...

Robatech is launching EdgePro, a new hot-melt adhesive application head for high-quality edge banding. The user-friendly coating head applies EVA, PUR and polyolefin adhesives uniformly and repeatably, and is characterized by a particularly clean cut-off behavior. The EdgePro offers numerous handling advantages, which enable fast format changes and savings in the spare parts inventory. The...

The Swiss manufacturer of adhesive application solutions will not be exhibiting at the packaging trade fair interpack or the print media trade fair drupa in February/April 2021. Robatech is thus taking responsibility and, due to Covid-19, is giving top priority to the health of visitors and employees. The company is announcing that it will be...

From Nov 9 – 13, 2020 Robatech will present sustainable solutions for fast and reliable adhesive application on primary and secondary packaging at the virtual trade show PACK EXPO Connects. Live engagement will be possible through live chats and live product demos that highlight time- and cost-saving systems for safe operation and secure bonding. Robatech’s...